环硅氧烷阳离子乳液聚合动力学研究

论文编号:HG068  论文字数:7703,页数:19

摘要： 有机硅阳离子乳液具有十分优异的耐温、耐候、耐化学品，并可赋予纺织皮革制品十分柔顺的手感，因此应用十分广泛。而其合成工艺-环硅氧烷阳离子乳液聚合是典型的活性可逆平衡聚合，近年来一直受到人们的密切关注。因此本研究以八甲基环四硅氧烷（D4）为单体，KOH为催化剂，采用复合乳化剂进行环硅氧烷阳离子乳液聚合，并用重量法测定聚合产物的转化率。在此基础上，详细讨论了阳离子乳化剂用量、非离子乳化剂用量、KOH用量、温度、搅拌速度和水油比对聚合反应速率的影响。结果表明，非离子乳化剂用量增加，聚合速率单调地增加；温度升高，聚合速率增加，平衡转化率则不变；水油比对聚合速率无本质影响；阳离子乳化剂用量、KOH用量增加及搅拌速度增大时，聚合速率则先单调增加，再下降。

关键词： 环硅氧烷；阳离子乳液聚合；动力学；聚合速率；

Cyclosiloxane Cationic Polymerization Kinetics

Abstract：Silicone cationic emulsion has very excellent heat, weather resistance, chemical resistance, will give textile leather products feel very submissive, very broad application. And the synthesis - cyclosiloxane cationic polymerization activity is a typical reversible balance polymerization, In recent years, we have been paying close attention to the people. In this study, eight D4 (D4) for the monomer, KOH as catalyst composite emulsifier for cyclosiloxane cationic emulsion, and using weight Determination polymerization products of the conversion. On this basis, a detailed discussion of cationic emulsifier, nonionic emulsifier, KOH concentration, temperature, Mixing speed and water-oil ratio on the polymerization reaction rate impact. The results show that the non-ionic surfactant consumption increased polymerization rate monotonic increase; Temperature increases, the polymerization rate increase balance conversion rate will remain unchanged; water-oil ratio on the polymerization rate no essential; cationic emulsifier. increase the amount of KOH and stirring speed increases, the rate of polymerization is first monotonous, then dropped.

Keywords：Cyclosiloxane ; Cationic polymerization ; Kinetics; Polymerization rate;  
       
 
 目  录
中文摘要 I
英文摘要 II
目录 III
1. 绪论 1
1.1 有机硅乳液聚合概述 1
1.2 有机硅乳液研究的发展现状 2
 1.2.1 国内有机硅乳液聚合的发展现状 2
 1.2.2 国外有机硅乳液聚合的发展现状 3
1.3 本课题的提出 4
2. 实验部分 5
 2.1 主要原料和试剂 5
 2.2 主要仪器和设备 5
 2.3 实验流程和装置 6
 2.4 样品测试 7
3. 结果与讨论 8
 3.1 阳离子乳化剂用量的影响  8
 3.2 非离子乳化剂用量的影响 9
 3.3 KOH的影响 9
 3.4 温度的影响 10
 3.5 搅拌速率的影响 11
 3.6 水油比的影响 12
4．总结与展望 13
 4.1 总结 13
 4.2 展望 13
致谢 14
参考文献 15

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