Abstract
There is high interfacial energy between diamond and general metals which resulting the diamond grain can't be wetted by generally low-melting-point alloys and diamond grain will peel off easily. In order to improve the traditional process, the subject of experiment and used Cu as basic,Ti, Sn as an additional element of the new material,which can solve the problem of diamond infiltration.Diamond and Cu-based alloy which will mix directly with the high temperature brazing welding, while Cu-based melt at 850 ℃ diamond is wraped. Below 920 ℃ , it will not lead to graphitization of diamond and its hardness is suitable for solder itself.,easy out in the cutting edge. So using this solder for manufacturing diamond tools.
Keywords: Artificial Diamond; Cu-Based alloy; Infiltration; High-temperature Brazing; Tool